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Optical Fiber Telecommunications IV-B, Volume B, Fourth Edition: Systems and Impairments by Ivan P. Kaminow

Ivan P. Kaminow, "Optical Fiber Telecommunications IV-B, Volume B, Fourth Edition: Systems and Impairments"
Publisher: Academic Press | ISBN: 0123951739 | edition 2002 | PDF | 1047 pages | 27,6 mb

The fourth installment in this popular series summarizes recent developments in light wave communications

Optical Fiber Telecommunications IV-A, Volume A, Fourth Edition: Components by Ivan P. Kaminow

Ivan P. Kaminow, "Optical Fiber Telecommunications IV-A, Volume A, Fourth Edition: Components"
ISBN: 0123951720 | edition 2002 | PDF | 907 pages | 22,2 mb

- Fourth in a respected and comprehensive series
- Authoritative authors from a range of organizations
- Suitable for active lightwave R&D designers, developers, purchasers, operators, students, and analysts
- Lightwave components reviewed in Volume A
-Lightwave systems and impairments reviewed in Volume B
- Up-to-the minute coverage

Phase-Locked Loops for Wireless Communications: Digital, Analog and Optical Implementations by Donald R. Stephens

Donald R. Stephens, "Phase-Locked Loops for Wireless Communications: Digital, Analog and Optical Implementations"
ISBN: 0792376021 | edition 2001 | PDF | 343 pages | 11,6 mb

Phase-Locked Loops for Wireless Communications: Digitial, Analog and Optical Implementations, Second Edition presents a complete tutorial of phase-locked loops from analog implementations to digital and optical designs. The text establishes a thorough foundation of continuous-time analysis techniques and maintains a consistent notation as discrete-time and non-uniform sampling are presented. New to this edition is a complete treatment of charge pumps and the complementary sequential phase detector.

Semiconductor Packaging: Materials Interaction and Reliability by Andrea Chen

Andrea Chen, "Semiconductor Packaging: Materials Interaction and Reliability"
English | ISBN: 1439862052 | 2011 | 216 pages | PDF | 7,5 MB

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package.

The book focuses on an important step in semiconductor manufacturing—package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.

Attaining High Performance Communications: A Vertical Approach by Ada Gavrilovska

Ada Gavrilovska - Attaining High Performance Communications: A Vertical Approach
Publisher: Chаpman and Hаll/C.R.C. | 2009-09-21 | ISBN: 1420093088 | PDF | 416 pages | 6.44 MB

Technological Advances and Problems of High Performance Communications
An ecosystem of solutions along a stack of technology layers
Cohesively collecting state-of-the-art contributions from leading researchers in industry, national laboratories, and academia, Attaining High Performance Communications: A Vertical Approach discusses various issues pertaining to high performance communications in a particular layer of a vertical stack. It explores efficient interconnection hardware, the architectural aspects of network adapters and their integration with processor cores, the design of scalable and robust high performance end-to-end communications services and protocols, and system services and tools for new multi-core environments.
No single solution applied at one particular layer can help applications solve all performance-related issues with communication services. Instead, this book shows that a coordinated effort is needed among the layers. It covers many different types of technologies and layers across the stack, from the architectural features of the hardware, through the protocols and their implementation in operating system kernels, to the manner in which application services and middleware are using underlying platforms. The book also describes key developments in high-end platforms, high performance interconnection fabrics and communication libraries, and multi- and many-core systems.
This volume addresses the challenges involved in emerging types of communications applications, platforms, and services. Examining each layer in the vertical stack, it illustrates how to eliminate bottlenecks and provide optimization opportunities.

Near-Infrared Applications in Biotechnology by Ramesh Raghavachari

Near-Infrared Applications in Biotechnology (Practical Spectroscopy) by Ramesh Raghavachari
  CRC Press; 1st edition (January 15, 2001) | ISBN: 0824700090 | Pages: 382 | PDF | 14.2 MB

An exploration of recent techniques in diagnostics, DNA sequencing, bioanalysis of immunoassays, and other applications promoting the use of near-infrared spectroscopy for medical and pharmaceutical purposes. Of interest to biotechnologists and researchers.

Third Generation CDMA Sy stems for Enhanced Data Services by Giridhar Mandyam

Giridhar Mandyam, "Third Generation CDMA Systems for Enhanced Data Services"
ISBN: 0124680410 | edition 2002 | PDF | 294 pages | 10,1 mb

Provides an overview and comparison of the code division multiple access (CDMA) systems presently being deployed for second- and third-generation cellular telephony. The authors, who are researchers for Nokia, explain the basic principles of direct-sequence spread spectrum systems, and describe the IS-95, cdma2000, 1X-EV, and wideband CDMA air interfaces and systems.